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Agilent HCPL-7860/HCPL-786J Optically Isolated Sigma-Delta (- Modulator -) -
Data Sheet
In operation, the HCPL-7860/ HCPL-786J Isolated Modulator (optocoupler with 3750 VRMS dielectric withstand voltage rating) converts a lowbandwidth analog input into a high-speed one-bit data stream by means of a Sigma-Delta (- ) over-sampling modulator. This modulation provides for high noise margins and excellent immunity against isolation-mode transients. The modulator data and on-chip sampling clock are encoded and transmitted across the isolation boundary where they are recovered and decoded into separate high-speed clock and data channels. Features * 12-bit Linearity * 200 ns Conversion Time (PreTrigger Mode 2 with HCPL-0872) * 12-bit Effective Resolution with 5 s Signal Delay (14-bit with 102 s) (with HCPL-0872) * Fast 3 s Over-Range Detection (with HCPL-0872) * 200 mV Input Range with Single 5 V Supply * 1% Internal Reference Voltage Matching * Offset Calibration (with HCPL0872) * -40C to +85C Operating Temperature Range * 15 kV/s Isolation Transient Immunity
8 SIGMA DELTA MOD./ ENCODE
Description The HCPL-7860/HCPL-786J Optically Isolated Modulator and HCPL-0872 Digital Interface IC or digital filter together form an isolated programmable two-chip analog-to-digital converter. The isolated modulator allows direct measurement of motor phase currents in power inverters.
1 2 Input Current 3 4 HCPL-7860
* Safety Approval: UL 1577, CSA and IEC/EN/DIN EN 60747-5-2
HCPL-0872 or Digital Filter MCU or DSP
7 DECODE 6
Applications * Motor Phase and Rail Current Sensing * Data Acquisition Systems * Industrial Process Control * Inverter Current Sensing * General Purpose Current Sensing and Monitoring
5
A 0.1 F bypass capacitor must be connected between pins VDD and Ground
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
SPI and QSPI are trademarks of Motorola Corp. Microwire is a trademark of National Semiconductor Inc.
Pin Description
ISOLATION BOUNDARY
V DD1 V IN+
1 2 3 4 5 6 7 8 SIGMADELTA MOD./ ENCODER DECODER
16 15 14 13 12 11 10 9
GND2 NC V DD2 MCLK NC MDAT NC GND2
V DD1
1 SIGMADELTA MOD./ ENCODE
8 7 DECODE 6 5
V DD2 MCLK MDAT GND2
V INNC NC NC NC
V IN+ 2 V IN- 3 GND1 4
SHIELD
GND1
HCPL-7860
Symbol VDD1 VIN+ VINGND1 Description Supply voltage input (4.5 V to 5.5 V) Positive input ( 200 mV recommended) Negative input (normally connected to GND1) Input ground
HCPL-786J
Symbol VDD2 MCLK MDAT GND2 Description Supply voltage input (4.5 V to 5.5 V) Clock output (10 MHz typical) Serial data output Output ground
Ordering Information Specify part number followed by option number (if desired). Example:
HCPL-7860#XXXX No option = Standard DIP package, 50 units per tube. 300 = Gull Wing Surface Mount Option, 50 units per tube. 500 = Tape and Reel Packaging Option, 1000 units per reel. XXXE = Lead-Free Option HCPL-786J#XXXX No option = Standard DIP package, 45 units per tube. 500 = Tape and Reel Packaging Option, 850 units per reel. XXXE = Lead-Free Option
Option data sheets available. Contact Agilent sales representative or authorized distributor. Remarks: The notation "#" is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use "-"
2
Package Outline Drawings 8-pin DIP Package
9.80 0.25 (0.386 0.010) 8 7 6 5
TYPE NUMBER
REFERENCE VOLTAGE MATCHING SUFFIX* DATE CODE
A 7860X YYWW PIN ONE 1.19 (0.047) MAX. 1 2 3 4
1.78 (0.070) MAX. 7.62 0.25 (0.300 0.010) 6.35 0.25 (0.250 0.010) 4.70 (0.185) MAX.
3.56 0.13 (0.140 0.005)
0.51 (0.020) MIN. 2.92 (0.115) MIN.
1.080 0.320 (0.043 0.013)
0.65 (0.025) MAX. 2.54 0.25 (0.100 0.010) 5 TYP.
0.20 (0.008) 0.33 (0.013)
DIMENSIONS IN MILLIMETERS AND (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (20mils) MAX. NOTE: INITIAL OR CONTINUED VARIATION IN THE COLOUR OF THE HCPL-7860/HCPL-786J'S WHITE MOLD COMPOUND IS NORMAL AND DOES NOT AFFECT DEVICE PERFORMANCE OR RELIABILITY. *ALL UNITS WITHIN EACH HCPL-7860 STANDARD PACKAGING INCREMENT (EITHER 50 PER TUBE OR 1000 PER REEL) HAVE A COMMON MARKING SUFFIX TO REPRESENT AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF 1%. AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF 4% IS GUARANTEED BETWEEN STANDARD PACKAGING INCREMENTS.
3
8-pin Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION 9.80 0.25 (0.386 0.010) 8 7 6 5 1.016 (0.040)
6.350 0.25 (0.250 0.010)
10.9 (0.430)
1
2
3
4 2.0 (0.080) 1.27 (0.050) 1.780 (0.070) MAX. 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010)
1.19 (0.047) MAX.
3.56 0.13 (0.140 0.005)
0.20 (0.008) 0.33 (0.013)
1.080 0.320 (0.043 0.013) 2.540 (0.100) BSC 0.51 0.130 (0.020 0.005)
0.635 0.25 (0.025 0.010)
12 NOM.
DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01 xx.xxx = 0.005 NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
LEAD COPLANARITY MAXIMUM: 0.102 (0.004)
16-Lead Surface Mount
LAND PATTERN RECOMMENDATION 0.457 (0.018) 16 15 14 13 12 11 10 9 TYPE NUMBER DATE CODE A 786J YYWW 7.493 0.254 (0.295 0.010) 11.63 (0.458) 1.270 (0.050) 0.64 (0.025)
2.16 (0.085) 1 2 3 4 5 6 7 8 ALL LEADS TO BE COPLANAR 0.002
10.312 0.254 (0.406 0.10) 9 8.986 0.254 (0.345 0.010)
0.457 (0.018)
3.505 0.127 (0.138 0.005)
0-8 0.025 MIN. 10.160 0.254 (0.408 0.010)
0.203 0.076 (0.008 0.003) STANDOFF
DIMENSIONS IN MILLIMETERS AND (INCHES). NOTE: Initial and continued variation in the color of the HCPL-786J's white mold compound is normal and does not affect device performance or reliability. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
4
Solder Reflow Temperature Profile
300 PREHEATING RATE 3C + 1C/-0.5C/SEC. REFLOW HEATING RATE 2.5C 0.5C/SEC. PEAK TEMP. 245C
PEAK TEMP. 240C PEAK TEMP. 230C
200
TEMPERATURE (C)
2.5C 0.5C/SEC. 160C 150C 140C 3C + 1C/-0.5C 30 SEC. 30 SEC.
SOLDERING TIME 200C
100 PREHEATING TIME 150C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE 0 0 50 100 TIME (SECONDS) 150 200 250
ROOM TEMPERATURE
Recommended Lead Free IR Profile
tp 260 +0/-5C Tp
TEMPERATURE (C)
TIME WITHIN 5C of ACTUAL PEAK TEMPERATURE 20-40 SEC.
TL T smax T smin
217C RAMP-UP 3C/SEC. MAX. 150 - 200C RAMP-DOWN 6C/SEC. MAX.
ts PREHEAT 60 to 180 SEC. 25 t 25C to PEAK
tL
60 to 150 SEC.
TIME (SECONDS) NOTES: THE TIME FROM 25C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200C, Tsmin = 150C
Regulatory Information The HCPL-7860/HCPL-786J has been approved by the following organizations: IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. UL Approval under UL 1577, component recognition program up to VISO = 3750 VRMS. File E55361. CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.
5
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics[1]
Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 300 Vrms for rated mains voltage 450 Vrms for rated mains voltage 600 Vrms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b VIORM x 1.875=VPR, 100% Production Test with tm=1 sec, Partial discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec,Partial discharge < 5 pC Highest Allowable Overvoltage(Transient Overvoltage tini = 10 sec) Safety-limiting values - maximum values allowed in the event of a failure. Case Temperature Input Current[3] Output Power[3] Insulation Resistance at TS, VIO = 500 V
[2]
Symbol
HCPL-7860/786J Unit I - IV I - III I - II 40/85/21 2
VIORM VPR
891 1670
Vpeak Vpeak
VPR
1336
Vpeak
VIOTM TS IS, INPUT PS, OUTPUT RS
OUTPUT POWER - PS, INPUT CURRENT - IS
800 700 600 500 400 300 200 100 0 0 25
6000 175 400 600 >109
Vpeak C mA mW
P S (mW) IS (mA)
Notes: 1. Insulation characteristics are guaranteed only within the safety maximum ratings, which must be ensured by protective circuits within the application. Surface Mount Classifications is Class A in accordance with CECC00802. 2. Refer to the optocoupler section of the Isolation and Control Components Designer's Catalog, under Product Safety Regulations section, (IEC/EN/DIN EN 60747-5-2) for a detailed description of Method a and Method b partial discharge test profiles. 3. Refer to the following figure for dependence of PS and IS on ambient temperature.
50 75 100 125 150 175 200 TS - CASE TEMPERATURE - oC
Insulation and Safety Related Specifications Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Parameter Symbol DIP-8 7.4 8.0 0.5 SO-16 8.3 8.3 0.5 Units mm mm mm Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector. DIN IEC 112/VDE 0303 Part 1
Minimum External Air Gap L(101) (Clearance) Minimum External Tracking (Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI L(102)
>175
>175
V
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
6
Absolute Maximum Ratings
Parameter Storage Temperature Ambient Operating Temperature Supply Voltages Steady-State Input Voltage Two Second Transient Input Voltage Output Voltages Lead Solder Temperature Solder Reflow Temperature Profile
Symbol TS TA VDD1, VDD2 VIN+, VINMCLK, MDAT
Min. -55 -40 0 -2.0 -6.0 -0.5
Max. 125 85 5.5 VDD1 + 0.5 VDD2 + 0.5
Units C C V V V
Note
1
260C for 10 sec., 1.6 mm below seating plane See Maximum Solder Reflow Thermal Profile section
2
Recommended Operating Conditions
Parameter Ambient Operating Temperature Supply Voltages Input Voltage Symbol TA VDD1, VDD2 VIN+, VINMin. -40 4.5 -200 Max. +85 5.5 +200 Units C V mV 1 Note
Electrical Specifications (DC) Unless otherwise noted, all specifications are at VIN+ = 0 V and VIN- = 0 V, all Typical specifications are at TA = 25C and VDD1 = VDD2 = 5 V, and all Minimum and Maximum specifications apply over the following ranges: TA = -40C to +85C, VDD1 = 4.5 to 5.5 V and VDD2 = 4.5 to 5.5 V.
Parameter Average Input Bias Current Average Input Resistance Input DC Common-Mode Rejection Ratio Output Logic High Voltage Output Logic Low Voltage Output Short Circuit Current Input Supply Current Output Supply Current Output Clock Frequency Data Hold Time Symbol IIN RIN CMRRIN VOH VOL |IOSC| IDD1 IDD2 fCLK tHDDAT 8.2 3.9 Min. Typ. -0.8 450 60 4.9 0.1 30 10 10 10 15 15 15 13.2 0.6 Max. Units A k dB V V mA mA mA MHz ns IOUT = -100 A IOUT = 1.6 mA VOUT = VDD2 or GND2 VIN+ = -350 mV to +350 mV 2 3 4 6 5 Conditions Fig. 1 Note 3 3 4
7
Electrical Specifications (Tested with HCPL-0872 or Sinc3 Filter) Unless otherwise noted, all specifications are at VIN+ = -200 mV to +200 mV and VIN- = 0 V; all Typical specifications are at TA = 25C and VDD1 = VDD2 = 5 V, and all Minimum and Maximum specifications apply over the following ranges: TA = 40C to +85C, VDD1 = 4.5 to 5.5 V and VDD2 = 4.5 to 5.5 V. STATIC CHARACTERISTICS
Parameter Resolution Integral Nonlinearity Differential Nonlinearity Uncalibrated Input Offset Offset Drift vs. Temperature Offset drift vs. VDD1 Internal Reference Voltage Absolute Reference Voltage Tolerance Reference Voltage Matching HCPL-7860 HCPL-786J dVREF/dTA dVREF/dVDD1 -VREF -200 INL DNL VOS dVOS/dTA dVOS/dVDD1 VREF -4 -1 -2 60 0.2 +VREF +200 -3 0 2 0.12 320 4 1 2 Symbol Min. 15 3 0.01 30 0.14 1 3 10 Typ. Max. Units bits LSB % LSB mV V/C mV/V mV % % % ppm/C. % mV mV TA = 25C. See Note 11 VIN+ = 0 V VIN+ = 0 V VIN+ = 0 V 7 7 7 8 8 8 8 8 10 5 6 Conditions Fig. Note 7 8 8 9
VREF Drift vs. Temperature VREF Drift vs. VDD1 Full Scale Input Range Recommended Input Voltage Range
DYNAMIC CHARACTERISTICS (Digital Interface IC HCPL-0872 is set to Conversion Mode 3.)
Parameter Signal-to-Noise Ratio Total Harmonic Distortion Signal-to-(Noise + Distortion) Effective Number of Bits Conversion Time Symbol SNR THD SND ENOB tC2 tC1 tC0 Signal Delay Over-Range Detect Time Threshold Detect Time (default configuration) Signal Bandwidth Isolation Transient Immunity tDSIG tOVR1 tTHR1 BW CMR 18 15 2.0 10 Min. 62 Typ. 73 -67 66 12 0.2 19 39 19 3.0 10 22 20 0.8 23 47 23 4.2 Max. Units dB dB dB bits s s s s s s kHz kV/s VISO = 1 kV VIN+ = 0 to 400mV step waveform Pre-Trigger Mode 2 Pre-Trigger Mode 1 Pre-Trigger Mode 0 Conditions VIN+ = 35 Hz, 400 mVpk-pk (141 mVrms) sine wave. Fig. 9,10 Note
11 1,12 1,12 1,12 13 14
12 13 13 14 15 16
15
17 18
8
Package Characteristics
Parameter Input-Output Momentary Withstand Voltage* Input-Output Resistance Input-Output Capacitance Input IC Junction-to-Case Thermal Resistance Output IC Junction-to-Case Thermal Resistance
Symbol VISO RI-O CI-O jci jco
Min. 3750 1012 1011
Typ.
Max.
Units Vrms
Conditions RH 50%, t = 1 min; TA = 25C VI-O = 500 Vdc TA = 100C f = 1 MHz
Note 19, 20 20 20
1013 1.4 96 114
pF C/W C/W
Thermocouple located at center underside of package
*The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an inputoutput continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification, or Agilent Application Note 1074, "Optocoupler Input-Output Endurance Voltage."
Notes: 1. If VIN- (pin 3) is brought above VDD1 - 2 V with respect to GND1 an internal opticalcoupling test mode may be activated. This test mode is not intended for customer use. 2. Agilent recommends the use of nonchlorinated solder fluxes. 3. Because of the switched-capacitor nature of the isolated modulator, time averaged values are shown. 4. CMRRIN is defined as the ratio of the gain for differential inputs applied between VIN+ and VIN- to the gain for common-mode inputs applied to both VIN+ and VIN- with respect to input ground GND1. 5. Short-circuit current is the amount of output current generated when either output is shorted to VDD2 or GND2. Use under these conditions is not recommended. 6. Data hold time is amount of time that the data output MDAT will stay stable following the rising edge of output clock MCLK. 7. Resolution is defined as the total number of output bits. The useable accuracy of any A/ D converter is a function of its linearity and signal-to-noise ratio, rather than how many total bits it has. 8. Integral nonlinearity is defined as one-half the peak-to-peak deviation of the best-fit line through the transfer curve for VIN+ = 200 mV to +200 mV, expressed either as the number of LSBs or as a percent of measured input range (400 mV). 9. Differential nonlinearity is defined as the deviation of the actual difference from the ideal difference between midpoints of successive output codes, expressed in LSBs. 10. Data sheet value is the average magnitude of the difference in offset voltage from TA =25C to TA= 85C, expressed in microvolts per C. Three standard deviation from typical value is less than 6 V/C. Beyond the full-scale input range the output is either all zeroes or all ones. The effective number of bits (or effective resolution) is defined by the equation ENOB = (SNR-1.76)/6.02 and represents the resolution of an ideal, quantization-noise limited A/D converter with the same SNR. Conversion time is defined as the time from when the convert start signal CS is brought low to when SDAT goes high, indicating that output data is ready to be clocked out. This can be as small as a few cycles of the isolated modulator clock and is determined by the frequency of the isolated modulator clock and the selected Conversion and PreTrigger modes. For determining the true signal delay characteristics of the A/D converter for closed-loop phase margin calculations, the signal delay specification should be used. Signal delay is defined as the effective delay of the input signal through the Isolated A/D converter. It can be measured by applying a -200 mV to 200 mV step at the input of modulator and adjusting the relative delay of the convert start signal CS so that the output of the converter is at mid scale. The signal delay is the elapsed time from when the step signal is applied at the input to when output data is ready at the end of the conversion cycle. The signal delay is the most important specification for determining the true signal delay characteristics of the A/D converter and should be used for determining phase margins in closed-loop applications. The signal delay is determined by the frequency of the modulator clock and which Conversion Mode is selected, and is independent of the selected Pre-Trigger Mode and, therefore, conversion time. The minimum and maximum overrange detection time is determined by the frequency of the channel 1 isolated modulator clock. The minimum and maximum threshold detection time is determined by the userdefined configuration of the adjustable threshold detection circuit and the frequency of the channel 1 isolated modulator clock. See the Applications Information section for further detail. The specified times apply for the default configuration. The signal bandwidth is the frequency at which the magnitude of the output signal has decreased 3 dB below its low-frequency value. The signal bandwidth is determined by the frequency of the modulator clock and the selected Conversion Mode. The isolation transient immunity (also known as Common-Mode Rejection) specifies the minimum rate-of-rise of an isolation-mode signal applied across the isolation boundary beyond which the modulator clock or data signals are corrupted. In accordance with UL1577, for devices with minimum VISO specified at 3750 Vrms, each isolated modulator (optocoupler) is prooftested by applying an insulation test voltage greater than 4500 Vrms for one second (leakage current detection limit II-O< 5A). This test is performed before the Method b, 100% production test for partial discharge shown in IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table. This is a two-terminal measurement: pins 14 are shorted together and pins 5-8 are shorted together.
11. 12.
15.
16.
13.
17.
18.
14.
19.
20.
9
1 0 -1 -2
IDD1 - mA
10.5 -40 C 25 C 85 C
9.4 9.2 9.0
IDD2 - mA
10.0
IIN - mA
-3 -4 -5 -6 -7 -8 -9 -6 -4 -2 0 V IN - V 2 4 6
9.5 9.0
8.8 8.6 8.4
8.5 8.2 8.0 -400 -200 0 V IN - mV 200 400 8.0 -400 -200
-40 C 25 C 85 C 0 V IN - mV 200 400
Figure 1. IIN vs. VIN .
Figure 2. IDD1 vs. VIN.
Figure 3. IDD2 vs. VIN .
10.0 9.8 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V
7 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V
0.02 0.018 0.016 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V
6 5
CLOCK FREQUENCY - MHz
9.6
INL-LSB
INL-%
-15 10 35 60 85
9.4 9.2 9.0
0.014 0.012 0.01
4 3
8.8 8.6 -40 -15 10 35 60 85
0.008 2 -40 0.006 -40 -15 10 35 60 85
TEMPERATURE - C
TEMPERATURE - C
TEMPERATURE - C
Figure 4. Clock Frequency vs. Temperature.
Figure 5. INL (Bits) vs. Temperature
Figure 6. INL (%) vs. Temperature
150 100
0.8 0.6
V REF CHANGE - %
68 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V 67 66 65
OFFSET CHANGE - V
50 0 -50 -100 -150 -40 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V -15 10 35 60 85
0.4 0.2 0 -0.2 -0.4 -40
SNR
64 63 62 V DD1 = 4.5 V V DD1 = 5.0 V V DD1 = 5.5 V -15 10 35 60 85
-15
10
35
60
85
61 -40
TEMPERATURE - C
TEMPERATURE - C
TEMPERATURE - C
Figure 7. Offset Change vs. Temperature
Figure 8. VREF Change vs. Temperature
Figure 9. SNR vs. Temperature
10
14 13 12
80 75 70
SNR
200 180 160 PRE-TRIGGER MODE 0 PRE-TRIGGER MODE 1 PRE-TRIGGER MODE 2
CONVERSION TIME - s
140 120 100 80 60 40 20 0
SNR
65 60 55 50
11 10 9 8
1
2
3
4
5
45
1
2
3
4
5
1
2
3
4
5
CONVERSION MODE #
CONVERSION MODE #
CONVERSION MODE #
Figure 10. SNR vs. Conversion Mode.
Figure 11. Effective Resolution vs. Conversion Mode.
Figure 12. Conversion Time vs. Conversion Mode.
100 90
100 90
SIGNAL BANDWIDTH - kHz
80
V IN+(200 mV/DIV.) OVR1 (200 mV/DIV.) THR1 (2 V/DIV.)
80 70 60 50 40 30 20 10 0
SIGNAL DELAY - s
70 60 50 40 30 20 10 0 1 2 3 4 5
1
2
3
4
5
2 s/DIV.
CONVERSION MODE #
CONVERSION MODE #
Figure 13. Signal Delay vs. Conversion Mode.
Figure 14. Over-Range and Threshold Detect Times.
Figure 15. Signal Bandwidth vs. Conversion Mode.
11
Applications Information Digital Current Sensing As shown in Figure 16, using the Isolated 2-chip A/D converter to sense current can be as simple as connecting a current-sensing resistor, or shunt, to the input and reading output data through the 3-wire serial output interface. By choosing the appropriate shunt resistance, any range of current can be monitored, from less than 1 A to more than 100 A.
Even better performance can be achieved by fully utilizing the more advanced features of the Isolated A/D converter, such as the pre-trigger circuit, which can reduce conversion time to less than 1 s, the fast over-range detector for quickly detecting short circuits, different conversion modes giving various resolution/speed trade-offs, offset calibration mode to eliminate initial offset from measurements, and an adjustable threshold detector for detecting non-short circuit overload conditions.
NON-ISOLATED +5V
ISOLATED +5V INPUT CURRENT + R SHUNT 0.02 C1 0.1 F V DD1 V IN+ V INGND1 V DD2 MCLK MDAT GND2 C2 0.1 F
CCLK CLAT CDAT MCLK1 MDAT1 MCLK2 MDAT2 GND
V DD CHAN SCLK SDAT CS THR1 OVR1 RESET + C3 10 F 3-WIRE SERIAL INTERFACE
HCPL-7860/ HCPL-786J
HCPL-0872
Figure 16. Typical Application Circuit.
12
Product Description The HCPL-7860/HCPL-786J Isolated Modulator (optocoupler) uses sigma-delta modulation to convert an analog input signal into a high-speed (10 MHz) single-bit digital data stream; the time average of the modulator's single-bit data is directly proportional to the input signal. The isolated modulator's other main function is to provide galvanic isolation between the analog input and the digital output. An internal voltage reference determines the full-scale analog input range of the modulator (approximately 320 mV); an input range of 200 mV is recommended to achieve optimal performance. HCPL-7860/HCPL-786J can be used together with HCPL-0872, Digital Interface IC or a digital filter. The primary functions of the HCPL-0872 Digital Interface IC are to derive a multi-bit output signal by averaging the single-bit modulator data, as well as to provide a direct microcontroller interface. The effective resolution of the multi-bit output signal is a function of the length of time (measured in modulator clock cycles) over which the average is taken; averaging over longer periods of time results in higher resolution. The Digital Interface IC can be configured for five conversion modes, which have different combinations of speed and resolution to achieve the desired level of performance. Other functions of the HCPL0872 Digital Interface IC include a Phase Locked Loop based pre-trigger circuit that can either give more precise control of the effective sampling time or reduce conversion time to less than 1 is, a fast over-range detection circuit that rapidly indicates when the magnitude of the input signal is beyond fullscale, an adjustable threshold detection circuit that indicates when the magnitude of the input signal is above a user adjustable threshold level, an offset calibration circuit, and a second multiplexed input that allows a second Isolated Modulator to be used with a single Digital Interface IC. The digital output format of the Isolated A/D Converter is 15 bits of unsigned binary data. The input full-scale range and code assignment is shown in Table 1 below. Although the output contains 15 bits of data, the effective resolution is lower and is determined by selected conversion mode as shown in Table 2 below.
Table 1. Input Full-Scale Range and Code Assignment.
Analog Input Full Scale Range Minimum Step Size +Full Scale Zero -Full Scale
Voltage Input 640 mV 20 V +320 mV 0 mV -320 mV
Digital Output 32768 LSBs 1 LSB 111111111111111 100000000000000 000000000000000
Table 2. Isolated A/D Converter Typical Performance Characteristics.
Conversion Time (s) Signal-toNoise Ratio (dB) 83 79 73 66 53 Effective Resolution (bits) 13.5 12.8 11.9 10.7 8.5 Pre-Trigger Mode 0 205 103 39 20 10 1 102 51 19 10 5 0.2 2 Signal Delay(s) 102 51 19 10 5 Signal Bandwidth (kHz) 3.4 6.9 22 45 90
Conversion Mode 1 2 3 4 5
Notes: Bold italic type indicates Default values.
13
Power Supplies and Bypassing The recommended application circuit is shown in Figure 17. A floating power supply (which in many applications could be the same supply that is used to drive the high-side power transistor) is regulated to 5 V using a simple zener diode (D1); the value of resistor R1 should be chosen to supply sufficient current from the existing floating supply. The voltage from the current sensing resistor or shunt (Rsense) is applied to the input of the HCPL-7860/ HCPL-786J (U2) through an RC anti-aliasing filter (R2 and C2). And finally, the output clock and data of the isolated modulator are connected to the digital interface IC. Although the application circuit is relatively simple, a few recommendations should be followed to ensure optimal performance.
FLOATING POSITIVE SUPPLY HV+ GATE DRIVE CIRCUIT
The power supply for the isolated modulator is most often obtained from the same supply used to power the power transistor gate drive circuit. If a dedicated supply is required, in many cases it is possible to add an additional winding on an existing transformer. Otherwise, some sort of simple isolated supply can be used, such as a line powered transformer or a high-frequency DC-DC converter. An inexpensive 78L05 threeterminal regulator can also be used to reduce the floating supply voltage to 5 V. To help attenuate high-frequency power supply noise or ripple, a resistor or inductor can be used in series with the input of the regulator to form a lowpass filter with the regulator's input bypass capacitor.
As shown in Figure 17, 0.1 F bypass capacitors (C1 and C3) should be located as close as possible to the input and output power-supply pins of the isolated modulator (U2). The bypass capacitors are required because of the highspeed digital nature of the signals inside the isolated modulator. A 0.01 F bypass capacitor (C2) is also recommended at the input due to the switched-capacitor nature of the input circuit. The input bypass capacitor also forms part of the anti-aliasing filter, which is recommended to prevent high-frequency noise from aliasing down to lower frequencies and interfering with the input signal.
+5V
R1 CCLK D1 5.1 V R2 39 MOTOR C1 0.1 F V DD1 V IN+ V IN+ R SENSE C2 0.01 F GND1 V DD2 MCLK MDAT GND2 C3 0.1 F CLAT CDAT MCLK1 MDAT1 MCLK2 MDAT2 GND V DD CHAN SCLK SDAT CS THR1 OVR1 RESET TO CONTROL CIRCUIT
HCPL-7860/ HCPL-786J
HCPL-0872 HV-
Figure 17. Recommended Application Circuit.
14
PC Board Layout The design of the printed circuit board (PCB) should follow good layout practices, such as keeping bypass capacitors close to the supply pins, keeping output signals away from input signals, the use of ground and power planes, etc. In addition, the layout of the PCB can also affect the isolation transient immunity (CMR) of the isolated modulator, due primarily to stray capacitive coupling between the input and the output circuits. To obtain optimal CMR performance, the layout of the PC board should minimize any stray coupling by maintaining the maximum possible distance between the input and output sides of the circuit and ensuring that any ground or power plane on the PC board does not pass directly below or extend much wider than the body of the isolated modulator. Shunt Resistors The current-sensing shunt resistor should have low resistance (to minimize power dissipation), low inductance (to minimize di/dt induced voltage spikes which could adversely affect operation), and reasonable tolerance (to maintain overall circuit accuracy). Choosing a particular value for the shunt is usually a compromise between minimizing power dissipation and maximizing accuracy. Smaller shunt resistances decrease power dissipation, while larger shunt resistances can improve circuit accuracy by utilizing the full input range of the isolated modulator. The first step in selecting a shunt is determining how much current the shunt will be sensing. The graph in Figure 18 shows the RMS current in each phase of a three-phase induction motor as a function of average motor output power (in horsepower, hp) and motor drive supply voltage. The maximum value of the shunt is determined by the current being measured and the maximum recommended input voltage of the isolated modulator. The maximum shunt resistance can be calculated by taking the maximum recommended input voltage and dividing by the peak current that the shunt should see during normal operation. For example, if a motor will have a maximum RMS current of 10 A and can experience up to 50% overloads during normal operation, then the peak current is 21.1 A (= 10 x 1.414 x 1.5). Assuming a maximum input voltage of 200 mV, the maximum value of shunt resistance in this case would be about 10 m.
40
MOTOR OUTPUT POWER - HORSEPOWER
The maximum average power dissipation in the shunt can also be easily calculated by multiplying the shunt resistance times the square of the maximum RMS current, which is about 1 W in the previous example. If the power dissipation in the shunt is too high, the resistance of the shunt can be decreased below the maximum value to decrease power dissipation. The minimum value of the shunt is limited by precision and accuracy requirements of the design. As the shunt value is reduced, the output voltage across the shunt is also reduced, which means that the offset and noise, which are fixed, become a larger percentage of the signal amplitude. The selected value of the shunt will fall somewhere between the minimum and maximum values, depending on the particular requirements of a specific design. When sensing currents large enough to cause significant heating of the shunt, the temperature coefficient (tempco) of the shunt can introduce nonlinearity due to the signal dependent temperature rise of the shunt. The effect increases as the shunt-to-ambient thermal resistance increases. This effect can be minimized either by reducing the thermal resistance of the shunt or by using a shunt with a lower tempco. Lowering the thermal resistance can be accomplished by repositioning the shunt on the PC board, by using larger PC board traces to carry away more heat, or by using a heat sink.
35 30 25 20 15 10 5 0 0 5
440 380 220 120
10
15
20
25
30
35
MOTOR PHASE CURRENT - A (rms)
Figure 18. Motor Output Horsepower vs. Motor Phase Current and Supply Voltage.
15
For a two-terminal shunt, as the value of shunt resistance decreases, the resistance of the leads becomes a significant percentage of the total shunt resistance. This has two primary effects on shunt accuracy. First, the effective resistance of the shunt can become dependent on factors such as how long the leads are, how they are bent, how far they are inserted into the board, and how far solder wicks up the lead during assembly (these issues will be discussed in more detail shortly). Second, the leads are typically made from a material such as copper, which has a much higher tempco than the material from which the resistive element itself is made, resulting in a higher tempco for the shunt overall. Both of these effects are eliminated when a fourterminal shunt is used. A fourterminal shunt has two additional terminals that are Kelvin-connected directly across the resistive element itself; these two terminals are used to monitor the voltage across the resistive element
while the other two terminals are used to carry the load current. Because of the Kelvin connection, any voltage drops across the leads carrying the load current should have no impact on the measured voltage. Several four-terminal shunts from Isotek (Isabellenhutte) suitable for sensing currents in motor drives up to 71 Arms (71 hp or 53 kW) are shown in Table 3; the maximum current and motor power range for each of the PBV series shunts are indicated. For shunt resistances from 50 m down to 10 m, the maximum current is limited by the input voltage range of the isolated modulator. For the 5 m and 2 m shunts, a heat sink may be required due to the increased power dissipation at higher currents. When laying out a PC board for the shunts, a couple of points should be kept in mind. The Kelvin connections to the shunt should be brought together under the body of the shunt and then run very close to each other to the input of
the isolated modulator; this minimizes the loop area of the connection and reduces the possibility of stray magnetic fields from interfering with the measured signal. If the shunt is not located on the same PC board as the isolated modulator circuit, a tightly twisted pair of wires can accomplish the same thing. Also, multiple layers of the PC board can be used to increase current carrying capacity. Numerous plated-through vias should surround each nonKelvin terminal of the shunt to help distribute the current between the layers of the PC board. The PC board should use 2 or 4 oz. copper for the layers, resulting in a current carrying capacity in excess of 20 A. Making the current carrying traces on the PC board fairly large can also improve the shunt's power dissipation capability by acting as a heat sink. Liberal use of vias where the load current enters and exits the PC board is also recommended.
Table 3. Isotek (Isabellenhutte) Four-Terminal Shunt Summary.
Shunt Resistance m 50 20 10 5 2 Tol. % 0.5 0.5 0.5 0.5 0.5 Maximum RMS Current A 3 7 14 25 [28] 39 [71] Motor Power Range 120 Vac-440 Vac hp 0.8 - 3 2-7 4 - 14 7 - 25 [8 - 28] kW 0.6 - 2 0.6 - 2 3 - 10 5 - 19 [6 - 21]
Shunt Resistor Part Number PBV-R050-0.5 PBV-R020-0.5 PBV-R010-0.5 PBV-R005-0.5 PBV-R002-0.5
11 - 39 [19 - 71] 8 - 29 [14 - 53]
Note: Values in brackets are with a heatsink for the shunt.
16
Shunt Connections The recommended method for connecting the isolated modulator to the shunt resistor is shown in Figure 17. VIN+ (pin 2 of the HPCL-7860/ HCPL-786J) is connected to the positive terminal of the shunt resistor, while VIN- (pin 3) is shorted to GND1 with the power-supply return path functioning as the sense line to the negative terminal of the current shunt. This allows a single pair of wires or PC board traces to connect the isolated modulator circuit to the shunt resistor. By referencing the input circuit to the negative side of the sense resistor, any load current induced noise transients on the shunt are seen as a common-mode signal and will not interfere with the currentsense signal. This is important because the large load currents flowing through the motor drive, along with the parasitic inductances inherent in the wiring of the circuit, can generate both noise spikes and offsets that are relatively large compared to the small voltages that are being measured across the current shunt. If the same power supply is used both for the gate drive circuit and for the current sensing circuit, it is very important that the connection from GND1 of the isolated modulator to the sense resistor be the only return path for supply current to the gate drive power supply in order to eliminate potential ground loop problems. The only direct connection between the isolated modulator circuit and the gate drive circuit should be the positive power supply line. In some applications, however, supply currents flowing through the power-supply return path may cause offset or noise problems. In this case, better performance may be obtained by connecting VIN+ and VIN- directly across the shunt resistor with two conductors, and connecting GND1 to the shunt resistor with a third conductor for the power-supply return path, as shown in Figure 19. When connected this way, both input pins should be bypassed. To minimize electromagnetic interference of the sense signal, all of the conductors (whether two or three are used) connecting the isolated modulator to the sense resistor should be either twisted pair wire or closely spaced traces on a PC board.
FLOATING POSITIVE SUPPLY HV+ GATE DRIVE CIRCUIT R1
The 39 resistor in series with the input lead (R2) forms a lowpass anti-aliasing filter with the 0.01 F input bypass capacitor (C2) with a 400 kHz bandwidth. The resistor performs another important function as well; it dampens any ringing which might be present in the circuit formed by the shunt, the input bypass capacitor, and the inductance of wires or traces connecting the two. Undamped ringing of the input circuit near the input sampling frequency can alias into the baseband producing what might appear to be noise at the output of the device.
D1 5.1 V R2a 39 R2b 39 MOTOR + R SENSE -
C1 0.1 F V DD1 V IN+ V INGND1 C2a C2b 0.01 F 0.01 F V DD2 MCLK MDAT GND2
HCPL-7860/ HCPL-786J
HV-
Figure 19. Schematic for Three Conductor Shunt Connection.
17
Voltage Sensing The HCPL-7860/HCPL-786J Isolated Modulator can also be used to isolate signals with amplitudes larger than its recommended input range with the use of a resistive voltage divider at its input. The only restrictions are that the impedance of the divider be relatively small (less than 1 k) so that the input resistance (280 k) and input bias current (1 A) do not affect the accuracy of the measurement. An input bypass capacitor is still required, although the 39 series damping resistor is not (the resistance of the voltage divider provides the same function). The low-pass filter formed by the divider resistance and the input bypass capacitor may limit the achievable bandwidth. To obtain higher bandwidth, the input bypass capacitor (C2) can be reduced, but it should not be reduced much below 1000 pF to maintain adequate input bypassing of the isolated modulator.
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsolete 5989-1485EN December 21, 2004 5989-2166EN

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